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Re: [OM] OM-4T weather sealing

Subject: Re: [OM] OM-4T weather sealing
From: Ken Norton <ken@xxxxxxxxxxx>
Date: Fri, 4 Mar 2011 13:47:44 -0600
> If the top was "raised" at all it was to provide additional clearance
> between circuit board and top to IC would not crack. No additional
> seals, especially between edge of top and body casting. Height of top
> was a big problem in original 2S, 3 and 4. With the 2S Herbert Keppler
> said "you have to practically stand on the top cover to re-seat it on
> the body".

OK, thanks for the clarification. Keppler definitely had a way with words, too.

AG
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